Magigoo HT (50ml)

$47.00

WHAT: MAGIGOO HT is designed for professional use, to work at high printing temperatures. The part should be relatively easy to remove once it cools and the glue residue should also be easily cleaned off.

WHY:

High temperature materials such as PEEK are advanced engineering thermoplastics which offer improved mechanical and chemical stability at elevated temperatures when compared to regular thermoplastics. Other materials include PEKK, Ultem and PPSU and their carbon/glass fibre reinforced counterparts. Owing to their high temperature and other exceptional properties these materials are highly sought after in high temperature and high performance engineering applications such as in the automotive and aerospace industries. Additionally these material are also sought after in the chemical, petrochemical, medical and research applications.

High temperature filaments prove to be challenging materials for FDM printing due to their higher tendency to warp. These materials are generally printed at elevated temperatures owing to their high temperature properties. MAGIGOO HT is a specialized solution for FDM printing of PEEK filaments which was developed to work at elevated printing temperatures.

HOW:

MAGIGOO HT has been designed and tested to work with build-plate temperature of 150 °C or lower.

Shake the bottle.
Apply to the desired area by pressing the nib on the bed (activating the inner valve) and spreading as needed.
Print according to the filament/printer manufacturers recommendations
Allow to cool and remove. The print should pop right off
Clean - Use a damp cloth to wipe off.

SAFETY:

Using this product with other than PEEK filaments might cause over adhesion and damage your build surface. Follow the instructions found in the technical data sheet for best results.

Tips:

For larger prints a 20 mm brim is recommended

Magigoo HT was designed for glass surface but also works on high temperature garolite and other build-surfaces

For full list of tested material and printer compatibility, please see here.